Low Outgassing Adhesives, Sealants & Coatings Master Bond — The Low Outgassing Epoxy Specialists  Ultra high purity and freedom from contaminants are essential requirements for adhesives and sealants used in electronics, electro-optics and optical manufacturing. Master Bond Inc. has developed a line of high purity, low outgassing epoxy resin systems to meet those most stringent performance requirements. These products are successfully employed in applications ranging from disk drives and flat panel displays to advanced avionics and aerospace components.
The Master Bond product line consists of both one and two component systems. They are available in a range of viscosities, cure speeds, etc. to best meet specific requirements. Electrically insulating, thermally conductive and electrically conductive grades are available. Outstanding performance can be obtained over the exceptionally wide temperature range of +200°C to liquid helium temperatures. Particularly noteworthy is the fact that their outgassing properties exceed the widely employed ASM E595-84 test standards accepted by NASA for space applications.  Master Bond systems are packaged for ease of use in one and two part syringes, cartridges, bubble packs, jars, metal and plastic containers and in drums. For ultimate convenience, our two component system are even available in premixed and frozen syringes! Any size can be accommodated from very small to very large.
Contact our knowledgeable, experienced technical team today for help in selecting the perfect Master Bond low outgassing system for your application. Some of Our Most Popular Low Outgassing Products...
| EP29LPSP |
Low viscosity, cryogenically serviceable epoxy with excellent physical properties for bonding or potting. Withstands cryogenic shocks. Superior electrical insulation properties. Optically clear. |
| EP21TCHT-1 |
Thermally conductive, two component epoxy with paste consistency. Cryogenically serviceable. High temperature resistant for bonding and sealing. Cures at room temperature. |
| EP37-3FLFAO |
Thermally conductive, lower viscosity, easy-to-use epoxy system system that cures flexible. Resistant to vibration, impact and shock. For potting & bonding. |
| EP30-2 |
Superior physical properties, excellent optical transmission characteristics, outstanding chemical resistance profile. Low viscosity enables easy application. |
| SUPREME 10HT |
One part, no-mix system requiring oven curing at 250-300°F with extraordinary physical properties. High peel and tensile shear strength. Cryogenically serviceable. Resistant to vibration, thermal shock and impact. |
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