Film Adhesives & Preforms

View information on FL901S silver conductive film adhesive
View information on FL901AO thermally conductive film adhesive

Master Bond Inc. manufacturers a line of epoxy film adhesives and preforms. These newly developed formulations include electrically conductive and thermally conductive compounds as well as structural adhesive films. The cured epoxy products offer excellent bond strength to both similar and dissimilar substrates along with high moisture and chemical resistance. They have fast cures at moderately elevated temperatures and long storage stability even at ambient temperatures, although refrigeration is preferred.

Master Bond epoxy films and preforms are easy to use, enhance productivity, simplify handling and reduce waste. They are applied as a solid, have no pot life restrictions and are environmentally friendly. When heated, the adhesive cures in place and squeeze out is avoided. Films are available in thicknesses of 2 to 8 mils and up to 16 inches square. Preforms can be laser or die cut to the configuration of any part. Both performance and processing characteristics are reproducible from lot to lot.

Master Bond’s experienced technical staff can custom formulate these high performance epoxy films and preforms to best meet specific application requirements. Grades can be adjusted for flexibility, electrical and thermal properties, temperature resistance, and chemical resistance, etc. Master Bond epoxy films and preforms are used in the computer, aerospace, telecommunications, automotive, electronic, military and optical industries. Specific applications include printed circuit boards, semiconductor packaging, smart cards, EMI shielding, heat sinking, BGA packages, hybrid assemblies, lid sealing and laminating.