Potting and Encapsulation Compounds Designed to Protect Electronic AssembliesFor Superior Protection, Select Master Bond Potting & Encapsulation Compounds  Master Bond’s potting compounds are used in electrical and electronic applications to provide an environmental barrier to damaging conditions such as moisture, various corrosive chemicals, excessive heat, vibration, mechanical impact, thermal shocks and abrasion which might occur while the device is in operation. Some of potting compounds feature thermal adhesive characteristics, supplying thermal conduction paths in assemblies. A majority of our potting compounds are one part epoxy and two part epoxy potting systems. Other products include silicone potting, polyurethane potting and UV cure potting systems.
Master Bond’s potting compound vary in viscosity, cure speed, flexibility, conductive properties, chemical and temperature resistance, color, etc. Special formulations provide UL94V-0 flame resistance, high voltage insulation and exceptionally low coefficients of thermal expansion. Additional properties include serviceability in cryogenic temperatures, NASA low outgassing approved and formulations that meet USP Class VI requirements, suitable for medical adhesive use. Select Master Bond, an advanced adhesive manufacturer, for your most critical application needs. Some of Our Most Popular Potting & Encapsulation Systems...
| EP30FL |
Low viscosity, optically clear epoxy. Ideal for thermal cycling and sensitive components. Has a room temperature or low elevated temperature cure. |
| EP30 |
Very low viscosity, rigid curing epoxy with excellent dimensional stability. Room temperature curable. Transparent. Ideal for optical applications. |
| EP37-3FLFAO |
Flexible, lower viscosity, thermally conductive epoxy. Meets NASA low outgassing specifications. |
| EP21LV |
Superb general purpose, room temperature curing epoxy potting material. Easy to use. Suitable for casting 1-2” high. Also available in a USP Class VI biocompatible version. |
| EP42HT-2 |
High temperature resistant epoxy capable of resisting 450°F. Also available in a USP Class VI medical grade. Resists repeated autoclaving. For best results, cure at room temperature followed by 150-200°F. |
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