IC PACKAGE and DEVICE CONVERTERS
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We offer over 800 adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues. We also offer "fix" adapters to solve layout problems and some known chip deficiences. Custom, quick turn solutions are our speciality | |
Solder Column Adapters Ironwood Electronics offers solder column adapters as a solution for leaded SMT packages such as QFP, PLCC, SOIC, SSOP, and TSOP. This is an excellent choice when you have a PC board in production that needs  Package Converter SSOP to SOIC (click for pic)an upgrade or you need to replace an obsolete part. The solder column adapter provides a fast, highly reliable connection at a fraction of the cost of competing designs. This makes it an excellent choice for either prototype or production quantities. The solder column adapter efficiently adapts one footprint to another footprint in a low-profile, compact design. The solder column adapter mounts directly to the SMT pads with a footprint no larger than the actual target land pattern. They are available with a 1:1 connection or a custom net list. Our state of the art design and manufacturing capabilities allow us to replace and upgrade the functions in legacy IC's. Parts can be manufactured as RoHS or non-RoHS compliant depending on your application. Solder Column Interface Soldering Techniques
Device Conversion When availability or performance of a given IC becomes an issue, an Ironwood device converter allows the use of a substitute device without Package Converter SSOP to SOIC (click for pic) requiring redesign of the target system. Package type, package code, even pin outs can be changed with an adaptor that fits in the original package space. We offer a number of standard device converter parts, however, device converters are typically developed to your unique specs.
"FIX" Adapters Fix adapters solve design or layout problems, often by modifing pin out, package code characteristics and/or package type. They may incorporate corrective circuitry. These adapters are generally custom solutions, however, we offer some fix adapters as standard products in our catalog.
Package Converters Package converters provide an electrical and mechanical conversion from one package type to another. We use gold plated interconnects for our pin and through hole converters. We offer products for each of the following package conversions. The part families are listed in "top interface to bottom interface" order. Follow the links to the on-line catalog's part selection. Be sure to check a part's drawing after selecting one.  Miscellaneous Package Converters
Many device specific package converters of all types have been lumped into this category. Pictured at right is a PGA to BGA converter which supports a Motorola 68338 device.
- DIP to DIP
These adapters change the width of your DIP package and use gold plated pins. Part numbers ending in "W" indicate wire wrap pin versions of the adapter.
- DIP/SDIP to PLCC
PLCC interfaces for DIP (or SDIP) packages. PLCC interface options: J-leaded surface mount foot (-J); PLCC plug (-P); and clip-on (-C). Some parts offer test points (-T).
- DIP/SDIP to QFP
These two-part adapters consist of a leadless QFP foot (solders to the target board's surface mount land pattern) and a DIP or SDIP top that plugs into the foot. Some parts offer test points (-T).
 DIP to SOIC
These adapters connect DIP packages to SOIC surface mount lands. We typically use a J-leaded foot that will interface with "J-lead" or gull wing land patterns. Parts are available in one-piece or two-piece (pluggable) versions.
- PGA to PLCC
These adapters connect a PGA package to a PLCC interface. Two interface options for the bottom PLCC interface are available: a surface mounted J-Lead or a pluggable foot for use with production sockets.
These converters can be combined with a PGA male to male socket to create a connection for an in-circuit emulator's female PGA head to a target board's PLCC footprint.
 PGA to QFP
These two piece adapters connect a PGA package to a QFP land pattern. The bottom QFP surface mount base part is available in gull-wing (-G) or low profile leadless (-L) versions. The top PGA part plugs to the base using gold plated connections.
- PLCC to PGA
These adapters allow PLCC devices to be mounted on PGA through hole patterns. The PLCC device is soldered to the adapter's surface mount lands, giving the highest possible reliability. They also provide a reduced height compared to our converters with ZIF sockets (described below).
- SOIC to DIP
These adapters allow SOIC packages to be mounted on DIP through hole patterns. The SOIC device is soldered to the adapter's surface mount lands, giving the highest possible reliability. The adapter will accomodate J-leaded or gull wing SOIC devices.
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