Giga-snaP™ BGA SMT ADAPTERS
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The new Giga-snaP™ line of BGA SMD adapters provide the most reliable interconnect to BGA SMT pads. These patent pending adapters remain attached through many solder cycles and will not warp as plastic molded parts. They also offer half the insertion force of other SMT adapters. | |
Giga-snaP™ BGA SMT Adapters -
Reliable, Easy to plug, High Speed
The Giga-snaP™ 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter line of products provide an inexpensive and reliable method for socketing 1mm BGA chips. The product line consists of patent pending female sockets with machined pins epoxy over-molded into an assembly that matches a particular BGA pattern. The epoxy over-molded female BGA socket is soldered to a PCB using standard soldering methods. A corresponding male pin BGA adapter, to which the user attaches their BGA chip, is plugged into the female socket on the board. The chip is interconnected, and the system is ready to go. The SMT adapters have the same solder ball types as the chip's they are emulating. A complete description and drawings of Giga-snaP™ 0.8, 1.0, and 1.27mm pitch BGA Surface Mount Feet Adapter can be found at:
These adapters have less than 1/3 the insertion force of competitive adapters, shorter electrical path for highest speed, and can be solder reflowed numerous times.
 Giga-snaP™ Spec
Cross Reference for the GigasnaP™ 1 mm parts for Xilinx and Altera
Renesas IC Package Cross Reference
Soldering Instructions
Benefits
The patent pending over molding method for the adapter results in a much more reliable device. The coefficient of thermal expansion (CTE) of the BGA SMT foot adapter exactly matches that of the PCB to which it is attached, thus eliminating failures caused by CTE mismatch. Thermal changes from either component heat dissipitation or environmental effects will not result in fractured solder ball connections. Secondly, the Gig-snaP SMT adapters can be reflowed up to at least 3 times while maintaining full integrity of all solder ball connections. Adapters with pressed pins tend to fracture the substrate, which allows the solder ball to flow up the pin and wick away - sometimes on the initial solder attachment.
With ball counts in the 1000-2000 range large forces are normally required when inserting the male device. The force to mate conventional adapters may exceed 80 pounds (356 Newtons) for a 1000 pin device. The Giga-snaP™ BGA Surface Mount Feet Adapters require less than 1/3 the force, only resulting in about 26 pounds (115 Newtons) for the same device.
The electrical path of the Giga-snaP™ BGA SMT foot adapters is a high priority performance issue. The physical length from the point where the top connection point on the male adapter to the solder ball on the female is only 4.5 mm. This is the shortest connection length available in a machined pin and socket combination, thus providing better transmission of high frequency signals.
Ironwood Electronics has the tooling, software, and equipment in place to deliver quickly any array, custom or standard 1 mm Giga-snaP™. Our speed of delivery for BGA SMT adapters sets the pace for the industry.
Description of the Giga-snaP™ Epoxy Overmold Adapter
Our patent pending epoxy over-mold method for Giga-snaP™ uses FR4 substrate with pins held by a thin ring of epoxy. The cured epoxy ring effectively seals the pin for optimum solderability. This solves the PCB fracturing problem and warping caused by press fitting into a substrate. This also allows us to use FR4 rather than plastic, thus avoiding CTE mismatch.
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