GHz BGA & QFN/MLF SOCKETS

Our GHz BGA & QFN/MLF sockets provide excellent signal integrity in a small, cost effective ZIF socket for prototype and test applications. They support pitches from 1.27mm down to 0.3mm. Standard sizes typically ship within 3 to 5 days ARO.

Ironwood Electronics offers a full product line featuring high performance and high endurance sockets for most applications. Depending on your application, these sockets can operate at bandwidths up to 12 GHz, and can withstand up to 500,000 insertions. The sockets are designed to dissipate up to seven watts without extra heat sinking and can handle up to 100 watts with a custom heat sink. Some other key features are that the sockets are solder-less and offer the industry's smallest footprint.

The following files are available in PDF format:

Ironwood's GHz BGA & QFN/MLF sockets are ideal for prototyping and testing almost any BGA device application. These ZIF sockets provide excellent signal integrity yet remain cost effective. We use innovative interconnect technology that delivers low signal loss (1dB at 6.5 GHz or 10GHz) and can support BGA or QFN/MLF pitches down to 0.3mm. Our sockets require far less PCB space than traditional mechanical-type sockets.

Ironwood's patent-pending designs utilize a unique, wire-filled elastomer to provide electrical connections to the BGA chip. The elastomer can be continuously used in applications with temperatures up to 85oC, with intermittent peaks to 150oC.

Multiple gold plated wires embedded within the elastomer contact each solder ball of the IC device. Each wire can easily carry typical IC power loads and results in a clean signal path approximately 1mm in length. Each socket is a precision device, guiding the IC to the exact position for connection and does not damage solder balls.

The basic GHz BGA sockets are mechanically mounted over a target system's BGA lands. These low-profile SMT sockets are only 2.5 mm per side larger than actual IC packages. They support IC devices with body sizes ranging from 42.5mm down to 7mm. Larger body sizes may require a backing plate.

Alternative adapter bases are available that emulate the chip's BGA footprint and convert the socket into an SMT device when through hole mounting is not possible, at some decrease in performance. The SMT adapter bases are easily installed using standard flux and reflow techniques.

The GHz Land Sockets allow the GHz BGA ZIF Sockets to be mounted on an adapter and then the male pin assembly can be either inserted into PCB holes or mounted on a Giga-snaP female BGA SMT adapter.

Epoxy Mount - If through-holes are unacceptable, or if an even smaller footprint is required, an epoxy mounting option may be considered. While this creates a more or less permanent bonding of the socket to the PC Board the socket is designed such that the contacting elements are replaceable should damage or excessive wear occur. These patented ZIF sockets are simply mounted to the target PCB by an epoxy band around the perimeter. The socket is placed into position with a precision alignment tool and epoxied in place. A ring of epoxy around the socket strongly holds it in place. There are special grooves on the socket wall for additional epoxy strength. The contactor can be easily replaced after hundreds of cycles.

Ordering GHz BGA & QFN/MLF Sockets

Our standard sockets support BGA packages with body sizes ranging from 7mm to 42.5mm square, in pitches 1.27mm to .5mm. The part selection table is ordered by maximum pin count. We typically ship standard GHz BGA & QFN/MLF sockets within 3-5 days.

Custom sockets to accomodate rectangular body shapes, odd sizes, and devices with pitches down to 0.3mm can be developed.

BGA package specifications can vary widely between manufacturers. We have found that it is most effective for us to ask customers for information about the specific device to be socketed and then provide a quote. To this end, we have provided a form to fill out that can be easily faxed back to us. Of course, you can always call us at 1-800-404-0204.

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