Signal Integrity Analysis and Power Integrity Analysis

Signal Integrity White Papers
	High-Speed Interconnect White Paper
	Power Integrity: PDS Design for FPGA Systems
	Gigabit Backplane SI Design Kit and White Paper

Ansoft simulation software can handle the complexity of modern interconnect design from die-to-die across ICs, packages, connectors and boards. By leveraging advanced electromagnetic-field simulators dynamically linked to powerful circuit and system simulation, engineers can understand the performance of high-speed electronic products long before building a prototype in hardware. This approach enables electronics companies to achieve a competitive advantage with faster time to market, reduced costs, and improved system performance.

Featured Products

SIwave™
SIwave™ analyzes complex printed circuit boards (PCBs) and IC packages prevalent in modern electronic products. The tool allows engineers to extract frequency-dependent circuit models of power distribution and signal nets directly from device layout (physical CAD) databases. Such circuit models aid in the identification of signal integrity and power-distribution network problems and are critical to designers seeking first-pass system success. An integrated DC IR drop computation module allows engineers to perform pre/post layout IR-drop verification to ensure that power distribution networks have the proper bump, ball, and pin sizes, as well as proper copper weighting. SIwave also helps mitigate electromigration concerns by flagging regions of high current density.

HFSS™
HFSS™ is the industry-standard software for S-parameter, Full-Wave SPICE™ extraction, and 3D electromagnetic field simulation of high-frequency and high-speed components. Engineers rely on the accuracy, capacity, and performance of HFSS to design on-chip embedded passives, IC packages, PCB interconnects, antennas, RF/microwave components, and biomedical devices.

Q3D Extractor®
Q3D Extractor® is 3D/2D quasi-static electromagnetic-field simulation for parasitic extraction of electronic components. Q3D Extractor utilizes the Method of Moments (MOM) and the Finite Element Method (FEM) to compute 3D RLC/2D RLCG parameters of a structure and automatically generates an equivalent SPICE sub-circuit. From this circuit model, designers can perform signal-integrity investigations to study EM phenomena such as crosstalk, ground bounce, and interconnect delay.

Nexxim®
Nexxim® is an advanced, frequency- and time-domain circuit simulator for engineers designing the next generation of high- performance DigitalRF CMOS ICs, GaAs/SiGe RFICs, SIP/SOC packages, power delivery systems and gigabit computer and communication backplanes. Dynamic, parameterized co-simulation with HFSS™ and Ansoft Designer® enables Nexxim to combine transistor-level detail for complex and highly nonlinear circuits with full-wave S-parameter models of the interconnect to provide the most accurate simulation capability for signal-integrity analysis and RF design.

TPA™
Turbo Package Analyzer™ (TPA) provides the package extraction and automation capability needed to address the electrical requirements of today's complex high-performance SiP, chip-scale, flip-chip, ball-grid array, and wire-bond. With TPA, IC and package designers of analog/RF and high-speed digital applications are able to fully characterize an entire package structure and automatically extract lumped or distributed RLC values for use with Nexxim® or alternative SPICE-compatible tools to perform subsequent transient analyses, such as crosstalk, overshoot, and TDR. TPA further enables the prediction of IC package performance and compatibility, facilitating performance trade-off analysis before a design is committed to fabrication. TPA couples with leading electronic package layout tools to accurately model package interconnect elements, such as non-orthogonal traces, vias, wire-bonds, and solder balls, and to take into account the non-ideal ground planes prevalent in these advanced IC package designs.